Signal Integrity
Full 3-D fullwave modeling of the structures
High-speed connectors
High-speed via interconnects
BGA breakout
Complete channel modeling
s-parameter model: insertion loss, return loss, cross-talk
PCB and Package layout review
Full 3-D fullwave modeling of the structures
High-speed connectors
High-speed via interconnects
BGA breakout
Complete channel modeling
s-parameter model: insertion loss, return loss, cross-talk
PCB and Package layout review